Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

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The second chip is arranged on the loader and is stacked with the first chip.

第二芯片配置于承载器上，并与第一芯片相堆叠。

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Instead of a single network of channels running through a stacked chip of this sort, he suggests there should be two.

ECONOMIST: Monitor

Dean McCarron, an industry analyst at Mercury Research, points out that this is already happening to some extent, since wires can cross over one another on a chip, though no actual transistors are stacked on top of each other.

ECONOMIST: REPORTS

By this stacked structure, large-scale circuits can now be mounted keeping small chip size.

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